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    METHOD FOR MANUFACTURING A THREE-DIMENSIONAL STRUCTURE, LAMINATE PRECURSOR FOR A THREE-DIMENSIONAL STRUCTURE AND METHOD FOR FORMING A THREE-DIMENSIONAL STRUCTUREIt is a multi-layered super-flat structure that can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with interlayer glues, and the laminate structure is flexed in the flexible layer between the rigid segments to produce an expanded three-dimensional structure, where the layers are joined at the locations of collage selected and separated in other locations.
    公开号:BR112013020233A2
    申请号:R112013020233-5
    申请日:2012-02-10
    公开日:2020-07-07
    发明作者:Pratheev Sreetharan；John Whitney；Robert Wood
    申请人:President And Fellows Of Harvard College；
    IPC主号:
    专利说明:

    METHOD FOR MANUFACTURING A THREE-DIMENSIONAL STRUCTURE, LAMINATE PRECURSOR FOR A THREE-DIMENSIONAL STRUCTURE AND METHOD FOR FORMING A THREE-DIMENSIONAL STRUCTURE
    GOVERNMENT SUPPORT 5 The invention was supported, in whole or in part, by concession under the Army Research Laboratory Contract Number W911NF-08-2- 0004, Foundation Contract Numbers CMMI-07466 38 and CCF-0926148 National Science and Contract Number FA9550-09-1-0156-DOD35CAP of the Air Force Scientific Research Bureau. The U.S. Government has certain rights in the invention.
    BACKGROUND The manufacture of micron-scale devices is dominated by micro-electro-mechanical structures (MEMS) technology, which typically involves a single flat substrate and serial processes. However, centimeter-scale manufacturing is covered by a wide variety of conventional machining processes. Manufacturing on the millimeter scale, however, is plagued by manufacturing and assembly problems that have a major impact on the costs and performance of micro robots and other functional mechanical devices on that scale.
    SUMMARY Three-dimensional structures and methods for their manufacture are described in this document. Various types of structures and methods can include some or all of the elements, attributes and steps described below. A three-dimensional can be formed by stacking a plurality of patterned layers and gluing the plurality of patterned layers at selected locations to form a laminate structure with interlayer collages. The laminate structure can then be expanded to an expanded three-dimensional configuration by selectively distorting at least one of the layers to produce gaps between layers while maintaining at least some of the interlayer collages.
    The layers in the structure can include at least one rigid layer and at least one flexible layer, where the rigid layer includes a plurality of rigid segments and the flexible layer can extend between the rigid segments to serve as a joint.
    The flexible layers are substantially less rigid than the rigid layers and may have a stiffness that is at least an order of magnitude (i.e., greater than 10x or greater than 100x) greater than the stiffness; similarly, the flexible layer can have at least 10 times or at least 100 times the flexibility of the rigid layers.
    The layers can then be stacked and glued at selected locations to form a laminate structure with interlayer glues and the laminate structure can be distorted or flexed to produce an expanded three-dimensional structure in which the layers are joined at the corresponding glue locations and separated into other locations.
    The methods and structures described in this document can be used, for example, through and beyond the entire millimeter-scale manufacturing process (for example, for apparatus with dimensions from 100 µm to 10 mm) and they allow for mass production of autonomous mechanisms, machines and robots precisely manufactured on this scale.
    Some of the manufacturing techniques described in this document may be the same or similar or similar to those used for the manufacture of multilayered printed circuit board (PCB), while some of the assembly techniques may be the same or similar or analogous to the techniques of montages used for MEMS, origami papers and pop-up books; and additional techniques used in these contexts can be adapted for use with this invention. When compared to traditional MEMS, the methods described in this document are extremely versatile in relation to the materials that can be used. In addition, 5 traditional MEMS are largely limited to the addition of volume of materials, whereas the methods described in this document can be used not only to add precisely standardized layers, but also complete subcomponents, such as integrated circuits, flexible circuits, actuators, batteries, etc. The thermal requirements of the multi-layer super-flat structures described in this document can also be much lower and the costs of manufacturing equipment can also be much lower. Furthermore, the processing steps in these methods in the various layers can be performed simultaneously in parallel, while much of the MEMS processing takes place sequentially in series. These methods can also be used to manufacture a wide variety of devices and structures within a device, including double-tee beams; large powered mirrors for use as optical switches; guiding antennas; high-speed, high-power physical switches; and robotic flight devices.
    BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows the manufacture, assembly and release steps in a schematic representation of the manufacture of a PC-MEMS machine. Figures 2a to 2d illustrate the formation of folding joints. Figures 3a to 3c show the sequential lamination steps in the manufacture of “mobee” using a medium plate to support the lead zirconate titanate (PZT) plates.
    Figure 4 is a single layer illustration made of 0-90-0 carbon fiber composite.
    Figure 5 is an exploded perspective view of a 15-layer press cure setting. 5 Figure 6 is a photographic perspective view of all 15 layers of Figure 5, as manufactured; two PZT plates for activation are visible near the bottom of the image.
    Figure 7 is a photographic view in perspective of the settlement of Figure 5 ready for press curing; a piezoelectric plate is visible after being picked up and placed; the second actuator plate is in an internal cavity in the seat.
    Figure 8 is an approximate photographic view of the clamp that holds the actuator in place.
    Figures 9a and 9b provide a schematic perspective view showing the operation of the mounting frame to achieve the desired mounting paths.
    Figure 10a includes a perspective view of a monolithic robotic bee (“mobee”) with loose-fitting joints highlighted by arrows; and Figures 10b-d provide schematic illustrations of the folding and locking steps with brass and weld plates.
    Figure 11 is a photographic perspective view of the “mobee” released prior to the assembly of the “pop-up”. Figure 12 is a photographic view in perspective of the “mobee” released after the assembly of the “pop-up”. Figure 13 is a photographic view in perspective from the rear angle of a “mobee” in a wraparound frame assembled from a multilayer laminate using a method of this development.
    Figure 14 is a front-angle photographic view of the “mobee” in Figure 13. Figure 15 is a front-view photographic view of the “mobee” in Figure 13. Figure 16 is a photographic view in perspective 5 of right side of the “mobee” in Figure 13. Figure 17 is a perspective photo view in lateral magnification of the “mobee” in Figure 13. Figure 18 is a rear angle perspective photo view of the “mobee” in Figure 13 before of the complete assembly with the layers only partially folded.
    Figure 19 is a rear-view photographic view of the “mobee” of Figure 13 against a white background.
    Figure 20 is a photographic view in perspective of the “mobee” after releasing the surrounding frame.
    Figure 21 is an illustration of the cuts in a shared layer of titanium and brass to form the wings and weld chocks in a “mobee”. Figure 22 is a wing resulting from the “mobee” with the membrane layers attached.
    Figure 23 is an illustration of a laminate stack and alignment instrument for monolithic fabrication.
    Figures 24 to 27 illustrate latch chain link structures manufactured by monolithic fabrication.
    Figures 28 to 30 illustrate the folding mechanism and layers of a Wright Flyer model.
    Figures 31 to 36 illustrate a spring-loaded monolithic structure for mounting on an eight-sided roof.
    Figures 37 to 42 show a sequence of film captures and animated clips showing the unfolding assembly of an icosahedron.
    Figures 43 to 48 show the sequence of clips from the icosahedron split assembly with most of the frame removed from view. Figure 49 is a side view of icosahedron 5 mounted in the middle of the frame. Figure 50 shows the underside of the frame and the rotating plate used to mount the icosahedron. In the accompanying drawings, similar reference characters refer to the same or similar parts in all different views. The drawings are not necessarily to scale, emphasis instead of being placed upon illustration of particular principles discussed below.
    DETAILED DESCRIPTION The foregoing and other attributes and advantages of the various aspects of the invention (s) will be evident from the following more detailed description of the various specific concepts and modalities within the broader limits of the invention (s). The various aspects of the story presented above and discussed in greater detail below can be implemented in any of a number of ways, as the story is not limited to any particular way of deployment. Examples of specific deployments and applications are provided primarily for illustrative purposes. Unless defined, used or otherwise characterized in this document, the terms that are used in this document (including technical and scientific terms) should be interpreted as having a meaning that is consistent with their accepted meaning in the context of the relevant technique and they should not be interpreted in an idealized or excessively formal sense unless expressly defined in this document. For example, if reference is made to a particular composition, the composition can be substantially, although not perfectly pure, as practical and imperfect realities can be applied; for example, the potential presence of at least residual impurities (for example, less than 1 or 2% by weight or volume) can be understood to be within the scope of the description; similarly, if reference is made to a particular shape, the shape is intended to include imperfect variations of ideal shapes, for example, due to machining tolerances.
    Although the terms first, second, third, etc., can be used in this document to describe various elements, these elements should not be limited by those terms.
    These terms are simply used to distinguish one element from another.
    In this way, a first element discussed below could be designated a second element without departing from the teachings of the exemplifying modalities.
    Spatially relative terms, such as "above," "upper," "below," "below," "lower," and the like can be used in this document to facilitate the description of describing the relationship of an element to another element, as illustrated in the Figures.
    It will be understood that the spatially relative terms are intended to cover different orientations of the device in use or operation in addition to the orientation described and / or depicted in the Figures.
    For example, if the apparatus in the Figures is moved, the elements described as "below" or "under" other elements or attributes would then be oriented "above" the other elements or attributes.
    Thus, the term exemplifier, "above," can encompass both an upward and downward orientation.
    The apparatus can be oriented in another way (for example, rotated by 90 degrees or in other orientations) and the spatially relative descriptors used in this document interpreted accordingly.
    Furthermore, in this disclosure, when reference is made to an element as being "in," "connected to" or "coupled to" another element, it can be directly 5 in, connected or coupled to the other element or elements of intervention may be present unless otherwise specified.
    The terminology used in this document is intended to describe particular modalities and is not intended to limit exemplary modalities.
    As used in this document, the singular forms, "one," "one", "o" and "a," are intended to also include plural forms, unless the context clearly indicates otherwise.
    In addition, the terms "include", "include," "comprise" and "understand" specify the presence of the declared elements or steps, but do not exclude the presence or addition of one or more other elements or steps.
    The apparatus for this disclosure is described in this document and can be used in a variety of applications, including the PARITy transmission train described in PCT Application No. U.S. 2011/24479, called "Passive Torque Balancing in a High-Frequency Oscillating System." The device is a multi-layered super-flat structure.
    By "plane," is represented a layer or plane that can be distorted, flexed or bent (these terms can be used interchangeably in this document). One embodiment of this structure can be achieved, for example, by forming a compound of five layers with the following sequence of layers: rigid layer, adhesive layer, flexible layer, adhesive layer, rigid layer.
    Alternatively, a thinner compound can be formed from a stack of only a rigid layer, an adhesive layer and a flexible layer, although this structure is not symmetrical.
    The rigid layers are machined to have intervals that correspond to fold lines, while the flexible layer is continuous, thus providing a joint where the flexible layer extends through the machined intervals 5 of the rigid layers.
    The characterization of the structure as being "superplanes" means taking multiple flat layers and connecting them selectively.
    An analogy can be made here to circuit boards, in which electrical pathways connect circuits in different layers.
    Here, on the contrary, the structure is made up of "mechanical tracks". By stacking multiple flat layers, the range of reachable devices is greatly expanded.
    The super-flat structure also allows attributes and components to be packaged in the structure that would not fit if the device could be made only from a flat sheet.
    Advantageously, super-flat structures with mechanisms that normally operate on the plane can now be made with these techniques.
    In practice, the formation of Sarrus connections between the flat layers is an advantageous strategy for designing a mounting mechanism / frame.
    Other mechanisms can be attached to the Sarrus links to perform the intended component turns.
    The multi-layer super-flat structure can be manufactured using the following sequence of steps, which are further described below: (1) machining each flat layer, (2) machining or standardizing adhesives, (3) stacking and laminating the layers under conditions for bonding, (4) post-lamination machining of the multilayer structure, (5) post-lamination treatment of the multilayer structure, (6) releasing a degree of freedom of assembly in each structure, (7) blocking the connections between structural members, (8) release any degrees of freedom from non-assembly and (9) separate the finished parts of a scrap board.
    A schematic representation of the PC-MEMS process is provided in Figure 1 which illustrates how basic micro-machining operations 101, laminating and retracting and placing 102, folding 103, lock 104 and additional micro-machining 105 can be arranged to manufacture PC- MEMS 106. These assembly techniques may include the formation of folding joints 21, as illustrated in Figures 2a-d, in which (a) the attributes are first micro-machined 101 in individual layers of material and the resulting chips 13 are removed; (b) during lamination, the peg pins 20 align the layers of material while heat and pressure are applied; here, two rigid layers of carbon fiber 12 glued to a flexible layer of polyimide film 16 with adhesive 14 form a five-layer laminate 15 termed as a "bonding sub-laminate"; (c) micromachining cuts mechanical bridges 17 that restrict individual elements, allowing the creation of articulated structures; and (d) a complete folding joint 21 is formed and removed from the surrounding frame 19. The cast pattern allows that flexion joint 21 to approach an ideal revolution joint.
    All assembly folds in a more complex assembly can be incorporated into a single degree of "pop-up" freedom, which can be locked in place by a welding process after the "pop-up" and then released by micro machining.
    A) “mobee” In one embodiment, this manufacturing method can produce a monolithic bee structure (“mobee”) 26, shown, for example, in Figure 12, including a rigid air frame 27, a piezoelectric actuator 24, a single degree of freedom power transmission and two wings 28. The “mobee” 26 can include eight subcomponents (for example, an actuator 24, an air frame 27, a slide crank, a transmission, two wing hinges and two wings 28) all 5 cofabricated in a single multilayer laminate, integrating a diverse palette of layers of materials including carbon fiber reinforced polymer, polyimide film, lead zirconate titanate (PZT) piezoelectric for actuator 24, brass for chocks 47 to lock the joints and titanium for the wing stringers 52. In one embodiment, the “mobee” 26 has a wing extension of 39 mm, a length of 18 mm, an off-plane height of 2.4 mm and a mass of 90 mg; and the wings 28 can rotate at a wide angle (for example, exceed 120º). In addition, the parallel “pop-up” folding and immersion weld lock processes replace the manual folding, assembly and gluing used in previous processes.
    The elimination of all manual skill steps allows for mass panel production of the “mobee” 26. The processes described in this document can be used in a similar way to form a wide variety of other structures, in addition to the “mobee” 26. 1) Machining of Layers In one embodiment, the multilayer structure is formed from a wide variety of thin layers (1.5 µm to about 150 µm thick) of various materials, as shown in Figures 3a to 3c.
    As shown in Figure 3a, the layers of carbon fiber 12, adhesive 14 and polyimide 16 are stacked with a spacer layer 39 that separates the respective connections 35 and 37, above and below.
    A medium plate 23 with an elevated section 33 for supporting the piezoelectric actuator 24 is also inserted between the spacer layer 39 and the lower connection 37.
    These layers are micro-machined by laser (for example, by a pulsed solid-state laser pumped by diode) with desired attributes, which generally cut the entire shape through the layer to create individual flat structures 5, as shown, for example, in Figures 6 The
    8. Each layer is micro-machined to leave a unified (contiguous) part with robust connections to the surrounding alignment holes. Micromachining can produce attributes on complex planes with dimensions as small as 10 µm. In particular embodiments, many copies of the “mobee” device 26 are formed on a laminate panel and the machining process removes enough material to form each part and part attribute, by leaving thin tabs to connect each device to the surrounding laminate; in this respect, the arrangement of devices on a laminate panel may be similar to that of a batch of circuit boards attached to a laminate structure surrounded by thin, easily breakable tabs. In this case, the tabs (bridges) 17 (shown in Figures 2a to 2c) that connect the devices to the surrounding laminate will be removed after lamination or assembly. The layers of metal, composite, polymer, etc., are machined or formed by virtually any method; and virtually any material can be used. Exemplary machining methods include laser cutting of sheet material, photochemical notches, punching, electroforming, electrical discharge machining, etc. Basically, any method that has appropriate resolution and compatibility with the desired material. The machined layers can then be subjected to additional processes, such as cleaning / indenting to remove machining debris, planing (for example, flattening molten copper into a layer to facilitate solder adhesion to it), glue preparation, annealing, etc. The unified nature of each layer facilitates handling and post processing.
    Advantageously, each layer can be a different material and can be machined and treated differently from each of the other layers. 5 Each layer can also be advantageously formed from a material that is sufficiently rigid, strong and hard to allow holes 22 to alignment pins 20 and other attributes to be machined in the layer, to facilitate easy handling and not to distort when placed when laying and when restricted by alignment pins 30. In other embodiments, layers that do not have structural stability to support the alignment attributes can, however, be used by attaching such layers, in volume form, to a rigid frame that meets these objectives without introducing sufficient additional thickness to disturb the other layers or parts in the laminate.
    In particular examples, a very thin polymer film (for example, 2 to 5 microns thick) is included between the layers.
    Due to its fineness and insulating qualities, the thin polymer film is prone to wrinkling and electrostatic handling problems.
    To address this trend, the thin polymer film can be slightly stretched, in volume, to a smooth, controlled flat state and then glued to a thin frame that is made, for example, of thin metal or fiberglass composite .
    Then, the thin polymer layer can be machined with the thin part attributes (for example, tiny holes in the polymer in precise locations) and the alignment hole attributes can be machined in the frame material.
    In additional embodiments, the device can be designed to mitigate thin-layer handling problems.
    For example, a part within the device can be designed so that all machining pertaining to a fragile layer is performed after lamination; and therefore, this layer will not require precision alignment when placed on the laminate, although, advantageously, the material can be placed on the laminate sufficiently smooth and that it extends in an area sufficient to cover the desired parts of the device .
    In exemplary embodiments, bulk polymer films (formed, for example, from polyester, polyimide, etc.); plates and sheets of metal and [formed, for example, of stainless steel, spring steel, titanium, copper, invar (FeNi36), nickel-titanium alloy (nitinol), aluminum, etc.]; copper-coated laminates; carbon fiber and glass fiber compounds; thermoplastic or thermoset adhesive films; ceramic plates; etc.; it can be laser machined to create the layers that are clad to form the multilayer structure.
    Laser machining can be carried out, for example, with a 355-nm laser (From DPSS Lasers Inc. of Santa Clara, California) with a spot size of about 7 microns on materials with typical thicknesses from 1 to 150 µm, despite the fact that the thicker layers can be satisfactorily machined with such a laser.
    Consequently, this type of laser allows for very high resolution and an ability to machine almost any type of material. 2) Machining or Patterning Adhesives Adhesion between layers is achieved by patterning adhesive on one or both sides of a non-adhesive layer or with the use of independent adhesive layers ("glue screens") 14. In the latter case, a intrinsically adhesive layer 14, for example, in the form of a thermoplastic or thermoset film adhesive sheet, or an adhesive laminate, such as a layer of structural material with adhesive pre-glued to one or both sides.
    The adhesive layer 14 is machined in the same way as the other layers.
    Specific examples of sheets that can be used as adhesive layer 14 include sheet adhesives 5 used to create flexible circuits (for example, DuPont FR1500 adhesive sheet) or polyimide film 16 coated with FEP thermoplastic adhesive 14 in one or both sides.
    Independent sheet adhesives can be based on acrylic for thermoforming; alternatively, the adhesive may be thermoplastic, in which the thermoplastic film may be formed of polyester, fluorinated ethylene propylene (or other fluoropolymer), polyamide, polyetachitercetone, liquid crystal polymer, thermoplastic polyimide, etc.
    Any of these adhesives can also be applied on one or both sides to a non-adhesive carrier.
    In additional embodiments, a layer can serve both as a structural layer 12 and as a thermoset adhesive 14-for example, liquid crystal polymer or thermoplastic polyimide.
    In addition, for special types of structural layers, a variety of tile bonding techniques that do not require an adhesive can be employed, such as melt bonding.
    In another technique to obtain adhesion between layers, adhesive 14 is applied and patterned directly on a non-adhesive layer 12. This technique can be used where, for example, the type of adhesive desired may not be susceptible to the independent form.
    Examples of such an adhesive 14 include welds, which are inherently angled to form a very thin layer, or adhesives that are applied in liquid form (by spraying, stencil marking, dipping, centrifugal coating, etc.) and then cured in stage B and standardized.
    Stage B epoxy films are commonly available, but they generally cannot be sustained unless they are thick or reinforced with etamine.
    The resulting glue can be a "sticky glue", where the adhesive 14 is lightly cross-linked to an adjacent layer prior to laser micromachining with sufficient sticking 5 to hold it in place for subsequent machining and with sufficient strength to allow removal of the adhesive backing layer.
    The sticky glue allows the creation of an "island" of adhesive 14 in a press seat that is not part of a contiguous part, which offers a significant increase in capacity.
    Another reason for sticking adhesive 14 to an adjacent structural layer is to allow unsupported "islands" of adhesive 14 to be attached to the other layer without having to physically link that desired patch of adhesive to the surrounding "frame" of material containing the alignment attributes.
    In one embodiment, a liquid adhesive capable of photoimaging, such as benzocyclobutene, can be applied to a thin layer, cooked and then patterned using lithography, leaving a selective pattern of adhesive.
    Other photo-imaging adhesives used in pasting pastes can also be used.
    Adhesive 14 is standardized while initially sticking to its carrier film, aligned to structural layer 12 using pins 20 and then sticking to at least one adjacent layer in settlement 29 with heat and pressure (for example, at 200 ºC and 340 kPa for an hour). Alternatively, the adhesive layer can be standardized by micromachining it as a free sheet.
    Sticky bonding may involve applying heat and pressure at a lower intensity and for less time than is required for a complete bonding of the adhesive.
    In yet another embodiment, the adhesive film 14 can be glued to the volume and then machined using, for example, a friction / notch laser.
    Advantageously, the use of this variation can be limited to contexts where the machining process does not damage the host layer.
    Both of these variations were experienced with the use of the DuPont FR1500 adhesive plate and 5 laser friction. 3) Stacking and Lamination of layers To form the multilayer structure of laminate 31, a wide variety of these layers (for example, up to 15 layers have been demonstrated) are ultrasonically cleaned and exposed to an oxygen plasma to promote bonding and aligned in a stack by passing several vertically oriented precision pin pins 20 respectively through several alignment openings 22 in each of the layers, as shown in Figures 4, 5 and 7 and using a set of smooth instrument plates with compatible relief holes for alignment pins 20. In other embodiments, other alignment techniques (for example, optical alignment) can be used.
    All layers can be aligned and laminated together.
    The connections in the laminated layers can be flat (where all the joint geometric axes are parallel); or the joint geometry axes can be non-parallel, allowing non-planar connections, such as spherical joints.
    In the fifteen-layer example, the final settlement 29 included the following layers, which formed a pair of connections (that is, structures in which the flexible layers 16 are glued to rigid segments 12 and extend through the gaps between the rigid segments 12 thus allowing flexion of the rigid segments 12 with respect to each other in the flexible layer 16 at the intervals between the rigid segments 12, where these exposed sections of the flexible layer 16 serve effectively as joints.
    In the embodiment of Figure 5, the layers are identified in the sequence of their stacking order as follows, where the "rigid" layers 12 comprise carbon and "flexible" layers 16 are formed of polyimide: 5 Bonding 1: 1) layer of carbon 12 2) acrylic sheet adhesive 14 3) polyimide film 16 4) acrylic sheet adhesive 14 5) carbon layer 12 6) acrylic sheet adhesive 14 Insulated Carbon Layer for Spacing: 7) carbon layer 12 8) acrylic sheet adhesive 14 Bonding 2: 9) carbon layer 12 10) acrylic sheet adhesive 14 11) polyimide film 16 12) acrylic sheet adhesive 14 13) carbon layer 12 14) acrylic sheet adhesive 14 Wing membrane : 15) wing membrane (polyimide film or polyester film) 18 The choice of flexible layers 16, which can be formed from a polymer-polyimide, in this example, is based on compatibility with the matrix resin on the carbon fiber.
    The curing cycle can reach a maximum temperature of 177 ºC using a four hour curing profile.
    The polyimide film (available, for example, as KAPTON film from E.I. du Pont de Nemours and Company), for example, has a service temperature high enough (up to 400 ºC) to survive the curing stage.
    The polyimide film can have a thickness of, for example, 7.5 µm.
    The rigid layers 12 in this modality are standard cured carbon fiber sheets (for example, with three layers of unidirectional fibers, where the fiber layers 5 are oriented at 0º, 90º and 0º to provide thickness in two orthogonal directions) that have a thickness of, for example, 100 µm.
    Fifteen layers are used due to the fact that adhesive sheet 14 (for example, in the form of a B-stage acrylic sheet adhesive, commercially available, for example, as DuPont PYRALUX FR1500 acrylic sheets) in this modality is separate from each layer structural material in the settlement 29 of this modality.
    Consequently, the adhesive sheet 14 can be laser machined in a pattern different from any structural layer and the aligned layings 29 of many layers can be made.
    This capability allows the manufacture of parts with many connecting layers that are perfectly or almost perfectly aligned.
    After the layers are stacked to form the seat 29, pressure and heat are applied, typically in a heated cylinder press to cure / crosslink the adhesive layers.
    Specifically, settlement 29 can be cured in a heated press, autoclave, or other device that provides the atmosphere (or lack thereof), temperature and pressure to obtain the bonding conditions required by the adhesive.
    One mode of the curing process uses a clamping pressure of 344.73 to 1378.95 Kpa (50 to 200 pounds per square inch (psi)), temperature of 350 ºF (177 ºC) and curing time of 2 hours (optionally with temperature variation control) to cure DuPont PYRALUX FR1500 acrylic sheets in a heated press with temperature, pressure and atmosphere control.
    Despite the fact that a single step lamination process has been demonstrated, a process with two sequential lamination steps may be preferred in several modalities due to the fact that it provides a third technique to change the composition of 5 layer formation and due to the fact that this can ease the chip removal problem.
    A separate structure of a micro-electro-mechanical printed circuit system (PC-MEMS) called a "middle plate" 23 can be included to change the layer stack under the PZT plate 24 during the initial lamination then removed, as shown in Figure 3, allowing accurate counting for the thickness of the piezoelectric plate 24. The medium plate 23 can be in the form of a simple reusable PC-MEMS laminate of a smooth carbon fiber plate that contains alignment holes and a central polyimide protuberance 33 designed to support the bottom PZT plate 24. This initial lamination results in two sublaminates 35 and 37, each with a layered structure that includes a sequence of carbon 12, adhesive 14, polyimide 16, adhesive 14 and carbon 12, as shown in Figures 3b and 3c.
    The middle plate 23 replaces the adhesive layer 14 on top of the lower sub-layer 37. The upper sub-layer 35 also includes the two PZT plates 24. An adhesive layer 14 is attached to the lower sub-layer 37 and micro-machined, while the upper sub-layer n35 is micro-machined separate the mechanical bridges in the central carbon spacer layer 39. After the chips are removed from the central carbon spacer layer 39, these two sublaminates 35 and 37 are stacked and laminated together to produce the laminate structure 31 shown in Figure 3c.
    The corresponding single-step process uses separate wedges under the bottom plate PZT 24 for support.
    In addition, machining steps often create regions of unwanted material, or "chips," that need to be physically removed.
    When the spacer layer 39 is micro-machined after the initial lamination, all chips of the micro-machining can be easily removed from the exposed surface.
    Post-lamination machining in a single step process results in stuck chips that need to be highly engineered to allow physical removal of the internal spacer layer 39. 4) Post-Lamination Machining Laminate 31 is then machined (for example, by flapping flaps with a laser) to free device (s) 26 from a surrounding frame structure in laminate 31. In some modalities, additional machining that is not involved in releasing device 26 from the outer frame (which circumscribes device 26 in laminate 31) is reserved for after lamination (for example, post-lamination machining of a layer that is structurally weak or that , for some other reason, cannot be precisely aligned since the weak layer is better supported after lamination). 5) Post-Lamination Treatment A post-lamination treatment can include plating or coating an exposed layer; and / or post-lamination treatment may include the addition of a material, such as solder paste, by screen printing or some other method, for example, for the subsequent joining of the "locking" step, as shown in Figure 10. Additional components can be attached to laminate 31 using a selection and placement methodology.
    Selection and placement operations can be used to insert separate components into settlements 29 prior to press lamination.
    For example, the insertion of a stimulus-responsive material 24, such as an electroactive material, can be inserted between the layers to serve as an actuator.
    In one embodiment, a lead zirconate titanate piezoelectric plate 24 is mounted on a spring clamp 25 on the carbon layer 5 (shown in Figure 8) and demonstrated the creation of a functional bimorph angle actuator within a device.
    A wide range of different components can be inserted in this way, such as mirrors or other optical components, microelectromechanical systems (MEMS), different sensors, etc.
    These components can alternatively be added beforehand, for example, before lamination at some point in the stacking process, or they can be added after the subsequent assembly of the device.
    Press lamination and laser micromachining can be conducted multiple times.
    For example, five layers can be micro-machined by laser, then laminated by press, then micro-machined by laser again.
    Another three layers can be separately micro-machined by laser, then laminated by press, then micro-machined by laser again.
    These two partial settlements can then be laminated by press together with a single adhesive layer between them, for a final settlement of nine layers. 6) Releasing the Degree of Freedom of Assembly in Each Part The resulting laminate can then be micro-machined by laser and / or scrap materials can be removed from the laminate to "release" the functional components in each part.
    The parts, as laminated, can be deployed to have many mechanical degrees of freedom acted and passive; nevertheless, in some embodiments, restricting these degrees of freedom without assembly during the assembly folding process is advantageous.
    For example, the elements of a bending connection can be held in place (i.e., locked) to prevent the connections from flexing by a rigid bar element along the elements or by a fixed flap that forms an integral bridge between the elements. elements and the surrounding structure.
    With the use of a machining process (for example, punch die or laser cut), the flaps or other features that restrict the degree of freedom of assembly are removed. 7) Assembly As manufactured, the “mobee” can be a flat laminate with multiple layers with limited three-dimensional structure.
    Its components are subjected to a variety of assembly paths to realize the final topology completely three-dimensional.
    A co-manufactured mechanical transmission called a "mounting frame" couples all of these assembly paths in a single degree of freedom.
    Mobee emerges from the manufacturing process as a machine with three degrees of freedom, although the internal mechanical connections eliminate these active degrees of freedom during assembly.
    The resulting mechanism uses 137 folding joints to assume a completely three-dimensional topology in one motion, similar to those created by folding paper in "pop-up" books. The assembly of the mobee 26 can include two parallel plates 42 and 43 of the mounting frame 19, one constructed from each connection sub-laminate 35 and 37, mechanically coupled to form a Sarrus 67 connection. These plates 42 and 43 surround the mechanical components of mobee and are restricted to a single degree of linear freedom that separates plates 42 and 43 along their normal axes.
    The interior connections 44 and 45, conducted by the plate separation, are connected to each of the core components of the mobee to realize all the desired assembly paths, as shown in Figures 9a and 9b.
    When the horizontally oriented upper plate 42 of the frame 19 is lifted, the inner connections lead to the mobee mounting folds.
    The Sarrus 19 connection mounting frame 5 provides a versatile framework for producing various mounting movements coupled in a single degree of freedom.
    Rotations for a wide range of angles around any axis in a connection plane can be achieved through an appropriately designed interior connection.
    Mobee also incorporates more complex interior connections to transfer the wings 28 and the actuator 24 along three separate arcs without rotation during the folding assembly.
    A plate 42/43 of the mounting frame 19 is attached to an external template, which drives six bushing pins 20 through clearance holes in the plate attached to separate the opposite plate 43/42. The separation of the frame plates 42 and 43 initiates a folding assembly with a single degree of freedom, making the mobee components come together to form their final three-dimensional configuration.
    Various mechanical elements interfere with the completed folding, creating a joint stop.
    The tabs on a 42/43 frame plate can be manually folded and inserted into slots on the opposite plate 43/42, creating support towers that keep the mounting frame 19 in its folded state, allowing it to be removed from the outer template.
    The assembly of the final device 26 (which includes the splitting of connections 44 and 45 in multiple planes) can be carried out manually by external actuation or the assembly can occur spontaneously.
    Where assembly is spontaneous, if one or more of the layers is pre-stressed, relaxation of the pre-stressed layers can lead to the device being assembled as soon as the degree of freedom of the assembly is released.
    The layer that is pre-tensioned can be, for example, a standard spring formed from spring steel or another spring-capable material, such as a titanium alloy and superelastic nickel (nitinol) or an elastomer material that can survive rolling conditions without annealing or degradation.
    The bushing pins and pin alignment holes in the pre-stressed layer can be configured to maintain that tension when the pre-stressed layer is in the stack through the lamination.
    The pre-tension can be in the form, for example, of tension or compression, although the compression may require the consideration of connection trends to buckle the plane.
    In other modalities, the actuators can be built on the laminate to perform the assembly.
    For example, a piezoelectric flex actuator, the shape memory layer or another type of actuator can be laminated forming the structure as a selection and placement component or inserted as an integral part of a layer in the settlement 29; and the actuator can be actuated, for example, by supplying electric current or by changing the temperature, to assemble the expanded three-dimensional structure 26. In one embodiment, the actuator is a bimorph angle that includes two 127 µm piezoelectric plates nickel-plated lead zirconate titanate (PZT) (PSI-5H4E, Piezo Systems, Inc.) plated with chrome to provide protection during the downstream locking process and attached to a central carbon fiber layer.
    The almost cinematic matching features and flat spring clips in the carbon fiber layer 12 or titanium layer 41 can keep each plate in alignment during lamination.
    Advantageously, in some embodiments, the assembly of all parts is carried out through a single degree of freedom of assembly so that the assembly proceeds in parallel across an entire panel, rather than part by part.
    Assembly can be done in several ways, depending on the design and the complexity of the part.
    For example, a human operator can operate the degree of freedom of manual assembly or 5 semi-automatically.
    In one embodiment, the degree of freedom of assembly is in the form of a plate connected to a Sarrus 67 connection that is pulled up or pulled down, as shown in Figures 9a and 9b.
    Spherical joints or four-bar mechanisms can be attached to the Sarrus connection, lifting and bending other components in their three-dimensional position.
    It is observed that through multiple flat layers of rigid flexion and selective adhesion, complex mechanisms and collections of mechanisms can be released in the assembly step. 8) Locking of Mounted Part Joints After mounting on a final three-dimensional structure, the structural members can be connected in a fixed configuration (that is, locked, fixed or frozen). In one embodiment, the adhesive can be manually applied to structural members and / or joints, although this approach may not be ideal if many parts are produced.
    Alternatively, adjacent members that have joined to form a locked joint can be automatically laser welded.
    If adjacent members 45 and 46 have metal blocks 17 (for example, formed of brass) in them, then dip or wave welding can form bonding with large fillets 48 between the members.
    Alternatively, the solder paste can be applied, for example, through screen printing before mounting on the laminate; and then, after assembly, a reflux step in a hot oven creates the collages.
    Other variations include the use of two-part adhesives, etc.
    In one embodiment, mobee 26 includes 52 brass blocks 47 distributed over the outer surfaces of its connecting sub-laminates, as shown in Figure 10a and shown with the arrows in Figure 10a.
    After folding, the blocks in separate links line up in 24 "5 glue points", in the form of two blocks 47 that are at right angles, as shown in Figures 10c and 10d, or three blocks forming the corner of a cube .
    The structure, kept in its folded state, is submerged in a water-soluble flow (for example, Superior Supersafe nº 30) and then preheated in an oven at 100ºC for 10 minutes.
    It is then immersed in eutectic lead-tin solder at 260ºC for approximately 1 second.
    Finally, the structure is ultrasonically cleaned in distilled deionized water to remove the water-soluble flow residue.
    The result of this welding process is the formation of weld fillets 48 at all bonding points, as shown in Figure 10d, eliminating the degree of freedom of assembly and locking all the different machine components together. 9) Release of Degrees of Freedom Without Assembly Any degrees of freedom without assembly in part 26 can be unlocked by removing any features (for example, connected tabs) that retain them through, for example, laser machining. 10) Separation of Parts from the Scrap Frame Now that the individual parts are completely assembled and ready for operation, parts 26 can be separated from the scrap frame (for example, an external frame to which the parts are connected by material bridges) frame 19 by laser machining, drilling, etc.
    Another monolithic “robotic bee”, “robobee” or “mobee” 26 with a PARITy transmission system manufactured with this technique using the 15 layers, described above, is illustrated before the “pop-up” assembly (ie , flattened) in Figure 11; a US dollar penny is placed adjacent to the robotic bee 26 to provide a size reference.
    The robotic bee 26 is shown after the “pop-up” in Figure 12. 5 Perspective views of another modality of mobee 26 are shown in the photographic images of Figures 13 to 20, where mobee 26 is mounted in the central region with a surrounding mounting frame 19 (which includes a hexagonal base plate 50 and a smaller insertion plate 51 raised above it) after unfolding the flat configuration (as in Figure 11) into which it is manufactured after gluing and laminating.
    The resulting released mobee is illustrated in Figure 20 against a twenty-five cent dollar coin for size comparison.
    As seen in Figure 20, mobee 26 includes an air frame 27, a plurality of connections separated by joints that form a transmission system, a pair of wings 28 for generating the flight, a bimorphic piezoelectric actuator 14 and a platform and input transmission 49, which couples actuator 24 to the rest of the transmission system.
    The elevated planes in mobee 26 are formed, for example, by producing three intersecting orthogonal cuts in multiple layers to form the mechanical tracks that can be folded at 90º to extend vertically and by gluing layers at the ends of the mechanical tracks to maintain connections between layers after three-dimensional assembly.
    The rectangular voids that are evident around the mobee 26 (shown in Figures 13 to 19) are left when the mechanical tracks are bent out of that base plane.
    Mobee 26 will be laser cut out of the frame after the joints are locked.
    This version incorporates bionic wing spars 52 made of titanium as well as brass blocks with a thickness, for example, of
    12.5 µm in the folding locations to lock the joints when the device is welded by immersion.
    Titanium can be fixed flat and stress relieved at 550ºC for one hour before assembly to reduce or eliminate the curvature 5 induced by micro machining.
    The wing membranes will be added at a later stage in the process.
    Mobee 26 includes carbon fiber components 12 for lightweight structural components with high rigidity, polyimide film 16 for resilient flexing, titanium alloy grade 25 41 for robust and complex wing spars 52 and medium hard brass for blocks solder 47 for automated joint locking.
    In another modality of the monolithic bee 26, several additional concepts are implemented, namely, layer sharing, post-release wing membrane molding and immersion weld blocks.
    This device has 10 structural layers and 8 adhesive layers.
    The laying is sequentially stacked as follows: Immersion weld blocks to facilitate joint sealing: 1) medium hard brass, 25.4um thick 2) glue Connection 1: 3) carbon fiber 4) glue 5) Kapton 6) glue 7) carbon fiber 8) glue Canvas carbon layer for spacing: 9) carbon fiber 10) glue
    Connection 2: 11) carbon fiber 12) glue 13) Kapton 5 14) glue 15) carbon fiber 16) glue Immersion weld blocks to facilitate joint sealing: 17a) medium hard brass, 25.4 µm thick wing: 17b) titanium alloy of grade 9 or 25, 50.8 µm thick Layers 1 to 13 of the previous design appear in this modality of the monolithic bee as layers 3 to 15. In this new modality, layers 1 and 2 allow that the solder blocks are placed on the bottom of the device, while layers 16 and 17a allow the solder blocks to be placed on top of the device.
    The hexagonal frame plate 50 and the smaller plate 51 suspended in parallel above that and within which the bee 26 is suspended through the connections (seen in Figures 13 to 19) form a Sarrus 67 connection and are restricted by connecting connections to have a degree of freedom; the smaller plate 51 can translate linearly upwards from the hexagonal plate 50. This is the degree of freedom of assembly.
    All components of bee 26 are connected by connections to these two plates; and a laser can later be used to cut these connections and release the bee 26. As the Sarrus 67 connection is actuated, each individual component of the bee 26 is bent to form its desired final configuration.
    Layer sharing:
    There is no adhesive layer between the uppermost brass 40 and the titanium layers 41 (layers 17a and 17b, respectively) in the above sketch.
    These two sublayers may be sharing the same layer, due to the fact that 5 are not overlapping and both engage with adhesive layer 14 (layer 16 in the sketch above), for example, glue, to stick to the carbon fiber layer 12 (layer 15 in the sketch above). Two ways to perform layer sharing are described below.
    In the first, multiple layers occupy areas not superimposed on the x-y plane.
    For example, four alignment pins 26 can be used.
    The brass layer 40 (17a) can cover half the entire area of the device, while the titanium layer 41 (17b) can cover the other half.
    Brass 40 can be used to form weld blocks 47, while titanium 41 can be used to form wing spars 52. Each sublayer (17a and 17b) can engage with only two of the four alignment pins 20 (ie two pins can engage with the brass sublayer (17a), while the two other pins can engage with the titanium sublayer (17b)). In an extreme situation, the layer can be divided into many sublayers if each sublayer is engaged with sufficient alignment pins.
    For example, a single layer with six sublayers may look like a map of New England, with each state made of a different material and with two alignment pins per state.
    A second way to achieve layer sharing (implanted in this modality of the monolithic bee) is by applying pressure to the layers that are not supported from below to flex the layers in the space below.
    Basically, if a large hole is cut into a thin layer, applying pressure to the layer immediately above it (or below it) can be designed to wrap and flex that adjacent layer around the edge of the hole, filling the hole.
    In this embodiment, the brass layer 40 (17a) covers the entire laminate area, but is machined with a large wing-shaped hole (shown 5 through white outline 54 in Figure 21). The titanium layer (17b) is stacked on top of the brass layer 40 (17a). The wing stringer pattern 52 is machined to form the titanium 41, with a bridge connecting the wing stringer 52 to the bulk titanium sheet.
    Nominally, this wing stringer pattern 52 is suspended above the cut hole of the brass layer 40. The titanium layer 41, however, is designed in such a way that it will flex slightly when laminating pressure is applied, allowing the wing engages the adhesive layer (16) through the hole in the brass layer 40 when pressure is applied.
    Immersion weld blocks: The brass blocks 47 for immersion weld are evident in the images of the monolithic bee shown in Figures 12 to 19 (particularly in Figure 18). The brass blocks 47 are golden (in contrast to the glossy yellow polyimide film that forms the joints) and many rectangular blocks 47 can be seen in the vicinity of the base of the actuator 24. The device is submerged in flow and then in welding, causing the weld fillets 48 to form in all the brass blocks 47 in proximity, locking the degrees of freedom of assembly in the mobee 26. Once this locking has occurred, the inner mobee 26 is cut from the locking mechanism large surrounding mount.
    Wing membrane lamination: After the initial lamination, the pop-up assembly and the pop-up locking, there are no membranes in the wing spars 52 of the monolithic bee 26 due to the difficulty of any membrane 53 that survives immersion welding process.
    Mobee 26 is released from the surrounding Sarrus hinge assembly mechanism 67, but its active degrees of freedom are not yet released.
    The mobee 26 is then removed by a second laminating step at 5, where the wing spars 52 are sandwiched between two layers of 1.5 µm polyester film (a thermoplastic). Heat and pressure (for example, 120ºC, 340 kPa for 15 minutes) cause the two films to stick together, sealing them in the spars 52 and, through this, form the membrane 53. The device is then placed on the laser to cut the outline of the wing 54. Then, only the active degrees of freedom of the bee 26 are released. The resulting wing 28 is shown in Figure 22. 11) Operation After manually attaching three wires to the piezoelectric actuator 24, mobee 26 is ready to operate.
    The application of an oscillating voltage to the piezoelectric actuator causes the reciprocating fin movement of the wings 28 (Figure 19), for example, at 100 Hz.
    As a complete machine, mobee 26 can be constitutively similar to Harvard's previous microrobotic insect (HMF); mobee 26 distinguishes itself by the precision and scalability of the manufacturing process used to produce this.
    B) Additional Modalities The flexing mechanisms and mounting folds result from the standardization and lamination of alternating compliant and rigid layers, similar to the construction of a flexion-rigid circuit board.
    These methods are extended with the concept of a super flat topology; the adhesive layers are standardized with a laser to allow the selective mechanical connection between multiple flat rigid-flexing layers.
    These "mechanical pathways" allow the creation of complex multilayer mechanisms, such as Sarrus connections, which can normally act for the work plane.
    The device's components can now reside in separate flat layers, which reduce interference during folding and allow greater complexity than possible with a single flat pattern.
    A detailed explanation of the manufacturing method and the presentation of three example parts are provided below to illustrate its potential.
    The last demonstrated device achieves self-assembly by introducing a pre-tensioned layer in the part's laminate.
    Laminate Manufacturing The process begins with the production of multilayer laminates.
    Each layer is first machined by volume to define the part's geometry.
    The layers (post-machining) remain contiguous to preserve the structural integrity of each layer and to provide a connection from each device component to the alignment pins.
    Most features can be machined, leaving small flaps or bridges that connect parts to the surrounding bulk material, similar to breakout flaps on panel circuit boards or part panels found in plastic model kits.
    In a later step, a second round of machining releases the individual parts.
    Any machining method that is compatible with the layer materials and meets the precision requirements of a particular application can be used, such as reactive depth ion engraving (DRIE), photochemical and electroforming (for metals) machining, laser machining and drilling.
    For the present research purposes, laser micromachining was used for its unmasked nature and for its compatibility with a wide range of materials.
    An Nd: YV04 DPSS laser was used, with q switching and frequency tripled to 355 nm.
    The maximum average power of the laser was approximately 1.5 Watts, which was concluded to be sufficient for machining layers in the thickness range from 1 to 150 microns.
    The beam was focused to a location of approximately 8 microns in diameter using a telecentric objective 5 lens.
    The full range accuracy and beam / part position repeatability was 2 microns or more.
    Such a laser easily machines most materials, with the exception of glass and others that are highly transmissive of 355 nm radiation.
    After each layer is machined, optional steps, such as electropolishing, ultrasonic cleaning and plasma treatment, can be performed to prepare each layer for lamination.
    In the manufacture of rigid printed circuit board (PCB), the circuit layers are usually bonded through the interleaving of pre-impregnated epoxy-fiberglass composite sheets (pre-pregs) or layers of adhesive bonded canvas.
    For this work, acrylic sheet adhesives were used.
    These adhesives are most commonly used to coat polyimide film (or other polymer) to form glue-laminate laminates (on two sides) or cover canvas (on one side), but are also available as a backing plate. free.
    PCB sheet adhesives are highly modified materials with customized thermal expansion properties and with very little flow during the bonding cycle.
    DuPont FR1500 acrylic sheet adhesive, 0.0005 inches (12.5 microns) thick, was used.
    First, the acrylic sheet adhesive was machined with alignment holes.
    Second, the acrylic sheet adhesive was added as a free supporting layer to the stack or, alternatively, tackily attached to an adjacent layer.
    For each technique, laser machining is used to standardize the adhesive.
    Other adhesives or adhesion methods can be used, but it has been found that the combination of properties in this type of adhesive is well suited for MEMS-scale microfabrication.
    Figure 23 illustrates the laminate stack and the alignment instrument used for this job.
    The 5 part layers are 25 mm on one side.
    Each outer layer 66 represents possible release, conformational and pressure distribution layers.
    Between the outer layers 66, the following layers are stacked in sequence from bottom to top: carbon fiber layer 12, adhesive layer 14, polyimide film 16, adhesive layer 14, pre-tensioned spring steel layer 68, adhesive layer 14, polyimide film 16, adhesive layer 14 and carbon fiber layer 12. The carbon fiber layer 12 has a 0-90-0 three-layer laminate pattern with a thickness of approximately 100 µm.
    Adhesive layer 14 is DuPont PYRALUX FR1500 with a thickness of 12.5 µm.
    The polyimide layer 16 is 7 µm thick KAPTON polyimide film.
    Finally, the spring steel layer 68 is 0.003 inch (76 µm) thick and laser machined with flat springs.
    The alignment holes are placed in such a way that this layer 68 needs to be stretched during stacking, which extends the flat springs and stores energy in the laminate.
    These springs lead to self-assembly of the “pop-up” once the device is completed.
    The multiple part 29 settlements can be connected simultaneously, using rigid separator plates between the stacks.
    Alignment accuracy is determined by several factors, such as the accuracy of holes 22 and alignment pins 20, thermal expansion coefficients (CTEs) of the layer materials and the size of the laminate.
    For alignment, standard precision chuck pins (1/16 inch) and alignment holes typically undersized by a few microns were used to benefit the elastic mean.
    In practice, post-lamination alignment is better than 5 microns.
    The exact numbers were difficult to measure, as this accuracy approximates the uniformity of the material and the edge roughness limits 5 of our materials and machining process.
    First, these methods were demonstrated by producing a correctly complex part of a very simple settlement; with only two rigid layers 12 separated by a single adhesive layer 14, a linked chain 56 was produced. Figures 24 and 25 illustrate the process with a simple two-link version.
    Essentially, the outline 57 of two interlocking rings is machined to form each rigid layer.
    However, where they were overlapped, a rigid layer 12 (top or bottom) continues and the other has a gap; for the other intersection, the reverse.
    The adhesive layer 14 is machined to prevent sticking between the two rigid layers 12 in both overlapping regions.
    Selective adhesion is an enabler of this part.
    After laser machining, the layers are aligned using pins 20 and connected.
    It is observed that in this application, the adhesive layer 14 is free-standing.
    It was concluded that PCB-type acrylic sheet adhesives (only 12.5 microns thick) have sufficient strength and stability to support their own and maintain precise alignment in the settlement.
    The chain is “simplified” after gluing by completing the sketch cut.
    A chain 56 manufactured in this way with 549 connections is shown in Figures 26 and 27. The rigid layers are carbon fiber composites, each 95 microns thick.
    They were cut from a 0-90-0 pre-cured unidirectional carbon fiber laminate (33 grams / m2 per canvas) impregnated with cyanate ester resin.
    This material is very strong, rigid and light; and this is easily machined by laser and has a low coefficient of thermal expansion.
    After lamination and simplification, chain 56 is simply lifted from the frame 19. Structure by Folding 5 Chain 56 provides a good example of the complexity possible when selective adhesion is used in laminated construction.
    Increasing the number of layers allows parts of greater complexity; however, this 3D printing approach operates in several limitations: as the thickness of the part grows, this makes it increasingly difficult to produce depth of simplification cuts in the part; excess support material typically needs to be removed; and structural elements normally aligned to the work plane are weakened through the interspersed adhesive layers.
    As described, in the present invention, folding has been explored as an alternative approach to producing 3D structures.
    There are many examples of folding that include origami, sheet metal construction and rigid-bending PCBs.
    A flat pattern is folded into wrinkles, cutout lines or flexible hinges.
    To form flat patterns in the present process, "bonds" of a rigid material were machined, separated by narrow intervals spread over a malleable material.
    These bends serve as mounting bends or mechanism joints.
    Structures of incredible complexity are possible through origami folding and modern algorithms can produce wrinkle patterns directly from a 3D model.
    A folding underside is typically the assembly challenge.
    When working with a single flat rigid-bending layer, the formation of complex shapes typically requires many sequential folds and, therefore, many degrees of freedom of assembly.
    If the goal is bulk production, assembly will ideally take place using only a single degree of freedom.
    A motivating example is a “pop-up” book, in which a single rotation results in the folding and assembly of many interconnected components 5.
    Unlike origami, pop-up book scenes, when closed and unfolded, include multiple folding layers.
    Using the laminate construction process described in this document, similar structures can be created.
    A model of the "Wright" 58 booklet is shown in Figures 28 to 30. A schematic view of the folding mechanism for the Wright 58 booklet is shown in Figure 28, while a photographic image of the model 58 (before folding / ”pop-up ”) Is shown in Figure 29. Finally, a perspective view of a first modality of the Wright 58 brochure template is shown on a twenty-five cent dollar coin in Figure 30 after folding (after the“ pop-up ” ”). Another modality of an eight-sided spring-loaded hexagonal enclosure 59 is shown in Figures 31 to 36. Specifically, the perspective views of structure 95 in contracted (before "pop-up") and acted (after "pop" states) -up ”) are respectively provided in Figures 31 and 32. The schematic top and side views of the contracted structure 59 are respectively provided in Figures 33 and 34, while a schematic side view of the structure 59 opened in“ pop-up ”with the actuation of a spring 60 on a layer of spring steel 68 under tension is provided in Figure 35. Finally, a top view of the spring mechanism 60 is shown in Figure 36. Monolithic Icosahedron Mounting a “pop-up icosahedron ”From PC-MEMS 62 is shown in Figures 37 to 48, which show a“ pop-up ”assembly process in increments of approximately three seconds.
    The contracted structure contained in and by a frame including two flat plates 32 is shown in Figure 37. The icosahedron 62 comprises 20 substantially identical triangular faces 34 and can be folded into an almost spherical shape 5 with 30 edges and 12 vertices.
    The bushing pins that support the top disk 32 are raised in Figures 38 to 42 to increase the separation between the plates 32, in which a real camera capture is shown at the bottom of each figure, with a corresponding computer generated image above .
    Mounted on the upper plate 32 'are three boards 36, each of which is pivotally mounted on the upper plate 32' through a fold and fixed to a respective triangular face 34 adjacent to the uppermost triangular face 34 ', as may be better seen in Figures 43 to 48, which show the “pop-up” assembly with the frame plates 32 removed for clarity of illustration.
    Different primary values for the triangular faces (i.e., faces 34, 34 'and 34) are provided for ease of illustration and characterization, although references in the present invention to "face 34" may refer to any of those faces.
    As the upper plate 32 'rises in relation to the bottom plate 32 ", the boards 36 pivot downwards and pull the respective triangular faces 34 to which they are fixed upwards, together with the other triangular faces 34 to which each is interconnected. around its edges.
    At its base, icosahedron 62 is mounted on an internal rotatable disk 38 (see, for example, Figure 41), which includes a plurality of outwardly extending tabs 63 extending under slits 64 in the lower frame plate 32 ", which act as a linear plane bearing, for reciprocal axial rotation in this.
    The bottom side of the bottom frame plate 32 "showing the flaps 63 against respective slots 64 in the bottom frame plate 32" is shown in Figure 50,
    although the slotted structure serves as a reserve here, since the connections leading to the rotatable disk are, in theory, sufficient to keep the disk rotating in the plane without any other connections.
    The rotatable disk 38 is turned 5 by pulling connections 65 which extend downwardly through a pivot point of the upper plate 32 '. As each connection 65 is raised, this drags the respective flap 63 to which each is coupled below the position where connection 65 is joined to the upper plate 32 ', thereby causing the rotation of the disk 38 in relation to the plates 32. Additional mechanical folding paths 44 are provided to support the top plate 32 'on the bottom plate 32 ". Here, many of the folds are at an angle of about 45 ° when the icosahedron is mounted; and the inner disc 38 is essentially rotated about 60º in the plane in relation to the plates 32 as the icosahedron 62 is unfolded.
    The resulting structure can then be locked in position, for example, using a welding technique, as described above.
    A side view of the folded icosahedron in the expanded frame is shown in Figure 49. The resulting icosahedron 62 can be used in a variety of applications, such as, for example, in camera shutter optics or in balloon angioplasty.
    In other embodiments, a sensor (for example, a camera) can be provided on each face 34 to provide multidirectional insect-like vision and perception.
    In yet other embodiments, a mirror, circuit board and / or a communication transmitter or receiver can be provided on each triangular face.
    Likewise, a variety of other complex shapes can be formed from them through a combination of unfolding and twisting by changing the configuration of folds, connections, planks, faces, mechanical paths, etc.
    In describing the modalities of the invention, specific terminology is used for clarity.
    For the purpose of description, the specific terms are intended to at least include technical and functional equivalents that operate in a similar way to achieve a similar result.
    In addition, in some cases where a particular embodiment of the invention includes a plurality of system elements or method steps, these elements or steps can be replaced by a single element or step; likewise, a single element or step can be replaced by a plurality of elements or steps that serve the same purpose.
    Additionally, where parameters for various properties or other values are specified in this document for the modalities of the invention, these parameters or values can be adjusted up or down by l / 100º, l / 50º, l / 20º, l / 10º , l / 5º, l / 3º, 1/2, 2 / 3º, 3 / 4º, 4 / 5º, 9 / 10º, 19 / 20º, 49 / 50º, 99 / 100º, etc. (or even by a factor of 1, 2, 3, 4, 5, 6, 8, 10, 20, 50, 100, etc.) or by rounded approximations of them, unless otherwise specified.
    In addition, although this invention has been shown and described in references to the particular embodiments thereof, those skilled in the art will understand that various substitutions and changes in shape and details can be made therein without departing from the scope of the invention.
    In addition, other aspects, functions and advantages are also included in the scope of the invention; and all the modalities of the invention do not necessarily have to achieve all the advantages or have all the characteristics described above.
    In addition, the steps, elements and resources discussed in this document in conjunction with one modality can likewise be used in conjunction with other modalities.
    Reference content, which includes reference texts, newspaper articles,
    patents, patent applications, etc., cited throughout the text are hereby incorporated by reference in their entirety for reference; and the components, steps and appropriate characterizations of those references may or may not be included in embodiments of this invention.
    In addition, the components and steps identified in the Background section are integral to this disclosure and can be used in conjunction with or replaced by components and steps described anywhere in the disclosure within the scope of the invention.
    In the claims of the method, where stages are mentioned in a particular order, with or without sequenced preface characters added for ease of reference, stages should not be interpreted as being temporarily limited to the order in which they are mentioned unless otherwise specified or implied by the terms and phrasing.
    权利要求:
    Claims (27)
    [1]
    1. METHOD FOR MANUFACTURING A THREE-DIMENSIONAL STRUCTURE, characterized by comprising: stacking a plurality of standardized layers and 5 gluing the plurality of standardized layers in selected locations to form a laminate structure with interlayer collages; and expanding the laminate structure to an expanded three-dimensional configuration through the selective distortion of at least one of the layers to produce gaps between the layers, while maintaining at least some of the interlayer collages.
    [2]
    2. METHOD FOR MANUFACTURING A THREE-DIMENSIONAL STRUCTURE, characterized by comprising: producing a plurality of layers with different patterns, in which the layers include at least one rigid layer and at least one flexible layer, in which the rigid layer includes a plurality of rigid segments that they are substantially more rigid than the flexible layer; then, stack the plurality of layers and glue the plurality of layers in selected locations to form a laminate structure with interlayer collages; and flexing the laminate structure in joints between the rigid segments to produce an expanded three-dimensional structure, in which the layers are joined at the selected bonding locations and separated at other locations.
    [3]
    METHOD according to claim 2, characterized in that the plurality of layers additionally comprises at least one adhesive layer which glues the rigid layer to the flexible layer.
    [4]
    4. METHOD according to claim 3, characterized in that the adhesive is a stage B acrylic plate adhesive.
    [5]
    5. METHOD, according to claim 2, characterized in that the plurality of layers is stacked through the passage of bushing pins through holes aligned in the layers and glued by a press. 5
    [6]
    METHOD according to claim 2, characterized in that it further comprises inserting at least one additional component between the layers as they are stacked.
    [7]
    7. METHOD, according to claim 6, characterized in that the additional component includes a stimulus-responsive material that serves as an actuator for an angle to which the stimulus-responsive material is joined, in which the stimulus-responsive material is electrically coupled to a power supply.
    [8]
    8. METHOD, according to claim 7, characterized in that the stimulus-responsive material is a piezoelectric plate.
    [9]
    Method according to claim 2, characterized in that it additionally comprises locking at least one of the joints in the structure after bending to form the expanded three-dimensional structure.
    [10]
    A method according to claim 9, characterized in that it further comprises coating the rigid layer with a molten metal in the joint to be locked and welding the molten metal to lock the joint.
    [11]
    METHOD, according to claim 9, characterized in that it further comprises applying adhesive to the joint to be locked to lock the joint.
    [12]
    12. METHOD, according to claim 9, characterized in that the structure comprises at least one sacrificial bridge that joins the rigid segments, the method further comprising removing the sacrificial bridge after locking the joint to release at least one degree additional freedom to move the rigid links.
    [13]
    13. METHOD according to claim 2, characterized in that at least one of the layers in the laminate structure 5 includes a pre-tensioned bending spring.
    [14]
    Method according to claim 13, characterized in that the bending spring comprises a layer of spring steel.
    [15]
    15. METHOD, according to claim 13, characterized in that the laminate structure includes at least one sacrificial bridge that prevents the laminate structure from folding, the method further comprising releasing tension on the spring by removing the bridge of sacrifice, in which the release of tension acts the folding to self-assemble the three-dimensional structure with a degree of freedom for assembly.
    [16]
    16. METHOD, according to claim 2, characterized in that at least two of the layers in the expanded three-dimensional structure are separated at a distance in a range of 100 µm to 10 mm from the interlayer collages.
    [17]
    17. METHOD according to claim 2, characterized in that at least some of the layers have a thickness in the range of 1.5 µm to 150 µm.
    [18]
    18. METHOD, according to claim 2, characterized in that it further comprises cutting the rigid layer with a laser to form the rigid segments.
    [19]
    19. METHOD according to claim 2, characterized in that the laminate structure includes a frame and at least one structure that is flexed to produce a final product, and in which the frame and structure that is flexed to produce the product end are joined by at least one sacrificial bridge, the method further comprising removing the sacrificial bridge.
    [20]
    20. METHOD according to claim 19, characterized in that the laminate structure includes a plurality of structures that can be flexed to form a final product, each of which is joined by at least one sacrificial bridge to the frame and released from the frame by moving away from the sacrificial bridge.
    [21]
    21. METHOD according to claim 2, characterized in that the rigid layer is coated with a conductive circuit.
    [22]
    22. METHOD according to claim 2, characterized in that the expanded three-dimensional structure comprises at least one I-beam.
    [23]
    23. METHOD according to claim 22, characterized in that a plurality of rigid layers is standardized, stacked and flexed.
    [24]
    24. METHOD, according to claim 22, characterized in that a plurality of flexible layers is standardized, stacked and flexed.
    [25]
    25. LAMINATE PRECURSOR FOR A THREE-DIMENSIONAL STRUCTURE, characterized by comprising an aligned stack of layers that includes: a plurality of rigid layers, in which the rigid layers include cuts that extend through them to form a plurality of rigid segments separated by the cuts ; and a plurality of flexible layers that is substantially less rigid than the rigid segments, wherein each flexible layer is attached to at least one of the rigid layers such that the flexible layer is exposed in the cuts in the rigid layer to form the folding joints , in which at least some of the layers are connected to adjacent layers only at selected locations that form islands of interlayer collages to allow the laminate to expand into an expanded three-dimensional structure when the laminate is folded at the joints.
    [26]
    26. METHOD FOR FORMING A THREE-DIMENSIONAL STRUCTURE 5 THAT USES A PLURALITY OF INTERCONNECTED FACES ASSEMBLED FOR EXPANSION AND ROTATION IN A FRAME, characterized by understanding: expanding the frame; raise at least one of the faces with the frame expansion; rotate at least some of the faces with the frame expansion; and locking the raised and rotated faces in the resulting three-dimensional structure.
    [27]
    27. METHOD according to claim 26, characterized in that the three-dimensional structure is an icosahedron.
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    同族专利:
    公开号 | 公开日
    US8834666B2|2014-09-16|
    JP2014512973A|2014-05-29|
    EP2673872A1|2013-12-18|
    CN103348580B|2016-10-19|
    US20150044418A1|2015-02-12|
    US9833978B2|2017-12-05|
    US20140202628A1|2014-07-24|
    CN103348580A|2013-10-09|
    WO2012109559A1|2012-08-16|
    EP2673872A4|2017-07-26|
    JP6014054B2|2016-10-25|
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    法律状态:
    2020-07-14| B15I| Others concerning applications: loss of priority|Free format text: PERDA DAS PRIORIDADES REQUERIDAS US 61/467,765 DE 25.03.2011 E US 61/561,144 DE 17.11.2011, POIS POSSUEM DEPOSITANTE DIFERENTE DO INFORMADO NA ENTRADA NA FASE NACIONAL E SUAS RESPECTIVAS CESSOES NAO FORAM APRESENTADAS, MOTIVO PELO QUAL SERA DADA PERDA DESTAS PRIORIDADES, CONFORME AS DISPOSICOES PREVISTAS NA LEI 9.279 DE 14/05/1996 (LPI) ART. 167O. |
    2020-07-21| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2020-09-08| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2020-10-13| B12F| Other appeals [chapter 12.6 patent gazette]|
    2020-12-22| B11B| Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements|
    2021-11-03| B350| Update of information on the portal [chapter 15.35 patent gazette]|
    优先权:
    申请号 | 申请日 | 专利标题
    USPCT/US12/024682|2011-02-11|
    US201161467765P| true| 2011-03-25|2011-03-25|
    US201161561144P| true| 2011-11-17|2011-11-17|
    PCT/US2012/024682|WO2012109559A1|2011-02-11|2012-02-10|Monolithic fabrication of three-dimensional structures|
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